AN-V-150

Copper in nickel plating bath

Summary

The concentration of Cu in a Ni plating bath is determined by polarography in chloride-containing acetate buffer at pH 4.7.

Download AN-V-150 (EN)

Kontakt

Metrohm Nordic AS

Sandviksveien 26
1363 Høvik

Kontakt

Explore more by industry

Metal products, plating & finishing

1 / 1

Finn Applikasjoner

Begrenset søket ditt(44)

Denne applikasjonen er merket under

// Plating baths – nickel

Online zinc/nickel plating bath analysis with X-ray fluorescence

// Plating baths – nickel // Automotive and aerospace // Metal products, plating & finishing

Lead stabilizer in an electroless Ni plating bath

// Plating baths – nickel // Automotive and aerospace // Semiconductors

Bismuth stabilizer in an electroless Ni plating bath

// Plating baths – nickel // Automotive and aerospace // Semiconductors

Antimony stabilizer in an electroless Ni bath

// Plating baths – nickel // Automotive and aerospace // Semiconductors

2 / 4