IC equipment Thin-Layer cell: without electrodes
6.5337.200
IC equipment Thin-Layer cell: without electrodes
ja
6.5337.200
特長
Equipment comprised of Thin-Layer cell with additional accessories, without electrodes.
-
- 50 µm spacer to Thin-Layer cell
- 6.1257.820
- 50 µm spacer for the amperometric Thin-Layer cell, 3 pcs.
- PCS
- 1
- 25 µm spacer to Thin-Layer cell
- 6.1257.840
- 25 µm spacer for the amperometric Thin-Layer cell, 3 pcs.
- PCS
- 1
- PEEK capillary 0.25 mm i.d. / 3 m
- 6.1831.010
- For all IC components.
- PCS
- 1
- Hexagon key 2.5 mm
- 6.2621.140
- PCS
- 1
- Pressure screw 2x
- 6.2744.014
- With UNF 10/32 connection. For the connection of PEEK capillaries
- PCS
- 1
- Polishing set for solid-state electrodes
- 6.2802.000
- Polishing set with 1 polishing cloth and about 2 g aluminum oxide powder (grain size 0.3 µm)
- PCS
- 1
-
- 50 µm spacer to Thin-Layer cell
- 6.1257.820
- 50 µm spacer for the amperometric Thin-Layer cell, 3 pcs.
- PCS
- 1
- 25 µm spacer to Thin-Layer cell
- 6.1257.840
- 25 µm spacer for the amperometric Thin-Layer cell, 3 pcs.
- PCS
- 1
- PEEK capillary 0.25 mm i.d. / 3 m
- 6.1831.010
- For all IC components.
- PCS
- 1
- Hexagon key 2.5 mm
- 6.2621.140
- PCS
- 1
- Pressure screw 2x
- 6.2744.014
- With UNF 10/32 connection. For the connection of PEEK capillaries
- PCS
- 1
- Polishing set for solid-state electrodes
- 6.2802.000
- Polishing set with 1 polishing cloth and about 2 g aluminum oxide powder (grain size 0.3 µm)
- PCS
- 1