Displacement Deposition of Platinum on Gold Electrodes
AN-EC-006
en
This document describes a very simple procedure that can be used to produce small deposits of platinum on a goldsubstrate. This simple procedure is based on an electrochemical process known as displacement deposition, during which the deposition of a noble metal occurs by the oxidation of a precursor metal adlayer deposited on the substrate, at open circuit potential (OCP).
This document describes a very simple procedure that can be used to produce small deposits of platinum on a gold
substrate. This simple procedure is based on an electrochemical process known as displacement deposition, during which the deposition of a noble metal occurs by the oxidation of a precursor metal adlayer deposited on the substrate, at open circuit potential (OCP).