Iodate in electroless nickel baths

Electroless nickel plating is an important and well established process in the surface finishing industry. In the past, the addition of small amounts of lead has widely been used to stabilize the plating bath. With the increasing number of restrictions in recent years on the use of lead in consumber products, particularly electronics, alternative stabilizers were developed and introduced. One of the stabilizers used as lead replacement is iodate. It can be used as a single additive or in combination with bismuth or antimony. This method allows the determination of iodate directly in the plating bath sample by polarography. The method is simple and fast, however, sensitive and robust.