An accurate, reproducible and reliable method for determining the organic additive content in acidic copper plating baths will increase the process stability during the production of printed circuit boards.The CVS (cyclic voltammetric stripping) technique allows the simple measurement and control of the concentration of the used organic additives in acidic copper plating baths. The technique utilizes an indirect measurement that uses the influence of the organic additives on the copper plating process to determine the additive concentration. The quantity of organic additives as well as the temperature of the measuring solution affect the reaction kinetics. The reduction rate of the Cu ions increases with increasing temperature. Hence, the quantity of copper deposited increases and so does the resulting signal. The influence of the temperature of the measuring solution on the relationship between additive concentration and signal is shown in the first part. In the second part the influence of the temperature difference between sample and intercept solution was examined.