Applications

Boric acid is used in many primary circuits of nuclear power plants, in nickel plating baths, and in the production of optical glasses. Furthermore, boron compounds are found in washing powders and fertilizers. This bulletin describes the potentiometric and thermometric determination of boric acid. The determination also covers further boron compounds, when acidic digestion is applied.

This Bulletin describes potentiometric titration methods for checking sulfuric acid and chromic acid anodizing baths. In addition to the main components aluminum, sulfuric acid, and chromic acid, chloride, oxalic acid, and sulfate are determined.

Potentiometric titration methods for the analysis of acid and alkaline tin plating baths are presented. The following methods are described: tin(II) / tin(IV) / total tin, free fluoroboric acid, or free sulfuric acid, chloride in acidic tin baths, free hydroxide, and carbonate in alkaline tin baths.

Methods are described for the potentiometric analysis of the following bath components:Brass plating bath: copper, zinc, free cyanide, ammonium, carbonate, and sulfite.Bronze plating bath: copper, tin, and free cyanide.

This Bulletin describes the potentiometric determination of lead, tin(II), and free fluoroboric acid.

This Bulletin describes titrimetric methods for the determination of cadmium, free sodium hydroxide, sodium carbonate, and total cyanide. The free cyanide can be calculated from the total cyanide and the Cd content.

This Bulletin describes the complexometric potentiometric titration of metal ions. An ion-selective copper electrode is used to indicate the endpoint of the titration. Since this electrode does not respond directly to complexing agents, the corresponding Cu complex is added to the solution. With the described electrode, it is possible to determine water hardness and to analyze metal concentrations in electroplating baths, metal salts, minerals, and ores. The following metal ions have been determined: Al3+, Ba2+, Bi3+, Ca2+, Co2+, Fe3+, Mg2+, Ni2+, Pb2+, Sr2+, and Zn2+.

This bulletin contains two parts. The first part gives a short theoretical overview while more details are offered in the Metrohm Monograph Conductometry. The second, practice-oriented part deals with the following subjects:Conductivity measurements in general; Determination of the cell constant; Determination of the temperature coefficient; Conductivity measurement in water samples; TDS – Total Dissolved Solids; Conductometric titrations;

Potentiometric titration is an accurate method for determining chloride content. For detailed instructions and troubleshooting tips, download our Application Bulletin.

This Bulletin describes the simultaneous potentiometric titration of free boric acid and free tetrafluoroboric acid in nickel plating baths. After addition of mannitol, the formed mannitol complexes are titrated with sodium hydroxide solution. The determination is carried out directly in the plating bath sample; nickel and other metal ions do not interfere.

This bulletin deals with the automated determination of mixtures of HNO3, HF and H2SiF6 in the range of approximately 200-600 g/L HNO3, 50-160 g/L HF, and 0-185 g/L H2SiF6 using thermometric titration.Etch acid mixtures containing HNO3, HF and H2SiF6 from the etching of silicon substrates can be analyzed in a sequence of two determinations using the 859 Titrotherm. The first determination involves a direct titration with standard c(NaOH) = 2 mol/L, followed by a back titration with c(HCl) = 2 mol/L. This determination yields the H2SiF6 content plus a value for the combined (HNO3+HF) contents. The second determination consists of a titration with c(Al3+) = 0.5 mol/L to determine the HF content. For freshly made up mixtures of HNO3 and HF containing no H2SiF6, a linked two-titration sequence is employed. Results from the two determinations are used by tiamoTM to yield individual results for HNO3, HF and H2SiF6.

In this Application Note, EIS is applied on three coated aluminium samples, before and after the stepwise dissolution measurement (SDM). This technique has been reviewed in the Application Note AN-COR-08.

Corrosion of metals is a problem seriously affecting not only many industrial sectors, but also private life, resulting in enormous costs. In this application note, the results gained during electrochemical corrosion studies on different metals are compared to literature data.

This Application Note details ASTM G61-compliant corrosion measurements performed with VIONIC powered by INTELLO using Metrohm’s ASTM-compliant corrosion cells.

The ASTM B825 is used to determine the corrosion and tarnish film on metal surfaces. This is achieved by using the so-called cathodic reduction method. With the help of a Metrohm Autolab PGSTAT302N and a Metrohm Autolab 1 L corrosion cell, a procedure to replicate the ASTM B825 is shown.

The International Standard ISO 17463 describes the determination of the anticorrosive properties of high impedance organic protective coatings on metals. This technique uses cycles composed of electrochemical impedance spectroscopy (EIS) measurements, cathodic polarizations and potential relaxation. This application note shows the compliance of the Metrohm Autolab PGSTAT M204 and flat cell with the standard ISO 17463.

Tafel analysis is an important electrochemical technique used to understand reaction kinetics. By studying the Tafel slope, it reveals the rate-determining steps in electrode reactions, aiding fields like corrosion and fuel cell research. This method helps industries optimize processes and improve device performance by tailoring materials and conditions for greater efficiency.

Determination of nickel in refinery and plating solutions. When other metals capable of being complexed by EDTA are present, these will interfere and enhance the result for nickel.

Thermometric titration of nickel in electroless plating solution with disodium dimethylglyoximate.

Determination of aluminum in acidic, basic, and neutral solutions; including aluminum chloride, aluminum chlorohydrate (also in anti-perspirant formulations), alum, etching solutions, and aluminate solutions.

Automated thermometric titration of the nickel content of electroless nickel plating solutions. The determination is suitable for fully automated titration employing a 814 Sample Processor.

A direct thermometric titration (TET) with 2 mol/L NaOH is used to determine the HF, NH4F, and maleic acid (C4H4O4) contents of acid cleaning solutions. Three endpoints (EPs) are obtained, which may be assigned as follows:EP1: C4H4O4 (pKa1 = 1.9), HF (pKa = 3.17)EP2: C4H4O4 (pKa2 = 6.07)EP2: NH4F (pKa = 8.2)The HF content is determined by subtracting the difference (EP2-EP1) from EP1.

The presence of the hydrated ion [Fe(H2O)6]3+ can interfere with the determination of «free acid» due to the low pKa value (~2.2) of this ion. Ions of metals such as Fe, Cu, and Al can be masked effectively with fluoride, and permit the determination of the acid content by thermometric alkalimetric titration with good accuracy and precision.

Thermometric titration is used to determine hydrochloric acid and hydrofluoric acid (hydrogen fluoride) in etching baths containing ethanol and acetonitrile. Two endpoints appear on the titration curve that are used individually for the quantification of the respective acid.

Tartaric Sulfuric Anodizing (TSA) is an established technique for corrosion protection in the aerospace industry. It is an alternative to the environmentally harmful chromic anodizing process. As such, a method to monitor the levels of sulfuric acid and tartaric acid in TSA plating baths is required. Potentiometric titration methods have been developed, and are widely used across the industry. Their disadvantage is that two titrations with different electrodes and solvents are required.In this Application Note, an alternative method is presented, where the concentration of both acids is determined in sequence using a thermometric sensor. Compared to potentiometric titration, thermometric titration is faster and more convenient (no sensor maintenance required). On a fully automated system, the determination of both parameters takes about 7 minutes.

Determination of fluoride in a chromium plating bath by direct potentiometry using the F-ISE.

Determination of nitrate in a nickel plating bath using anion chromatography with UV/VIS detection (205 nm).

In an electroless plating bath, the consumed ingredients have to be regularly replenished to ensure an even layer of nickel-phosphorus alloy. This requires online monitoring of the active bath constituents. Parameters to be controlled are pH value (4.5–5.0) as well as nickel (NiSO4 < 10 g/L) and hypophosphite concentration (NaH2PO2: 1–12%). Other measurement options include sulfate, alkalinity, and organic additives (via CVS).

Anodizing metal surfaces improves resistance against corrosion and wear. Etching baths can be monitored precisely online with the 2060 TI Process Analyzer or 2026 HD Titrolyzer.

Pickling baths are used in the galvanic industry to clean steel surfaces and prevent corrosion through passivation. Maintaining specific Fe2+/Fe3+ and free acid/total acid ratios is vital to ensure the baths' optimal performance, which directly impacts the final product quality and reduces production costs by minimizing reagent consumption. This application presents a method to regularly monitor the acid and iron composition in pickling baths online by using a process analyzer from Metrohm Process Analytics.

The 2060 XRF Process Analyzer continuously monitors elemental concentrations online within zinc-nickel electroplating baths to precisely guide chemical dosing.

Modern recreational use of DMT (N,N-Dimethyltryptamine) is growing and although it is legally protected in some countries, new legislation attempts to reduce its abuse and associated adverse health effects. MIRA XTR DS from Metrohm Raman provides rapid and sensitive detection of DMT in the field.

Determination of fluoride, chloride, and nitrate in a solution of NiSO4, ZnSO4 in sulfuric acid using anion chromatography with conductivity detection after chemical suppression.

Determination of chloride, sulfate, chromate, methanesulfonic acid (MSA), methanedisulfonic acid (MDSA), and ethanedisulfonic acid (EDSA) in a chromium plating bath using anion chromatography with conductivity detection after chemical suppression.

Determination of fluoride, MSA (methylsulfonic acid), EDSA (ethyldisulfonic acid), and MDSA (methyldisulfonic acid) using anion chromatography with conductivity detection after chemical suppression.

Determination of nitrate in a nickel plating bath using anion chromatography with UV/VIS detection (205 nm) after chemical suppression.

Determination of hypophosphite, phosphite, and phosphate in a nickel bath using anion chromatography with conductivity detection after chemical suppression and inline cation exchange.

Methanedisulfonic acid (MDSA) is used as a catalyst in chromium plating baths. The MDSA concentration in the bath must be known in order to monitor the chromating. The analysis of a bath sample requires dilution by a factor of 2,500. This Application Note shows the automatic Inline Dilution that takes place in two steps. While one sample is being analyzed, the time-optimized dilution of the next sample is already running. The MSM is regenerated using an 800 Dosino and the STREAM setup: The eluent is used for rinsing the regenerated MSM after exiting the detector.

Chrome plating is an important electroplating technique that covers metal or plastic surfaces with a thin layer of chromium for both protection and decoration purposes. The sulfate and sulfuric acid concentrations in the baths are important parameters in the coating process and require continuous monitoring. The anions in the chrome baths are separated on the Metrosep A Supp 5 - 250/4.0 column and are determined using conductivity detection in accordance with sequential suppression.

Determination of anionic surfactants in a nickel plating bath by potentiometric titration with TEGO®trant A100 using the «Ionic Surfactant» electrode.

Determination of Cr(VI) and Cr(III) in chromium baths by iodometric potentiometric titration with thiosulfate using the combined Pt electrode.

This Application Note treats the photometric titration of nickel using the Optrode (520 nm). Murexide was used as the indicator and EDTA as the titrant.

Rare earth elements (REEs) are critical materials whose deposit viability and processing streams require accurate mass-fraction determination during ore dissolution and purification. This Application Note describes a rapid potentiometric back-titration using a copper ion-selective electrode (Cu-ISE) that enables selective quantification and partial separation of REEs in complex matrices with near-quantitative recovery. As an absolute, flexible, and cost-effective method with ICP-compatible sample preparation, back-titration is well suited both as a reference technique and for rapid on-site analysis.

Determination of saccharin, benzamide, and o-toluenesulfonamide in a nickel electroplating bath using RP chromatography with UV detection.

The determination of iodate and iodide in used electroplating baths is a demanding task due to the high concentration of other ions. Iodate is used as a stabilizer for the bath and needs to be checked for proper electroplating. The use of a sodium chloride eluent, the Metrosep A Supp 5 - 250/4.0 column and direct UV/VIS detection permits the analysis of these samples without matrix interferences.

Lead is commonly used as stabilizer in electroless nickel plating processes. The regular and precise determination of the electrochemically active Pb(II) concentration is essential to keep the plating process running optimally under stable conditions. Differential pulse anodic stripping voltammetry can be used to determine the active lead content after dilution. The voltammetric determination has been established as a straightforward, sensitive, selective, and interference-free method for this application.

Determination of Cu and Cr in an etching bath. Due to the high concentrations of Mn and Ni, Cu is determined as the EDTA complex and Mn as DTPA complex.

Determination of Fe and Zn in a nickel sulfate bath containing surfactants after UV digestion.

Determination of Cu in a nickel sulfate bath containing surfactants after UV digestion.

The concentration of Fe(total) is determined polarographically in a chromium electroplating bath. The method is suitable for iron in concentrations in the ppm range. Fe(II) and Fe(III) show signals with the same sensitivity.

The concentration of Ni in a Ni plating bath is determined by polarography in ammonia buffer pH 9.6.

The concentration of Co in a sulfamate Ni plating bath is determined by adsorptive stripping voltammetry (AdSV) inammonia buffer pH 9.6 with dimethylglyoxime (DMG) as complexing agent. All reagents have to be added in the order listed below. Special care has to be taken that the measuring solution is mixed well before the complexing agent is added. In case of precipitations of Ni-DMG further dilution of the sample is necessary.

The concentration of Cu in a Ni plating bath is determined by polarography in chloride-containing acetate buffer at pH 4.7.

The concentration of Sb(III) and Sb(total) in an electroless nickel bath is determined by anodic stripping voltammetry (ASV). In c(HCl) = 0.6 mol/L only Sb(III) shows a signal. In w(HCl) = 10% the Sb(total) content is determined.

The concentration of Pd in an activator bath is determined by polarography in ammonium chloride electrolyte.

The concentration of Fe(total) is determined by polarography in oxalate buffer pH 2. This method is suitable for iron concentrations in the mg/L range.

The concentration of Fe(total) is determined by polarography in an alkaline electrolyte containing triethanolamine (TEA) and KBrO3. All reagents typically contain iron impurities. Therefore a subtraction of the reagent blank is recommended.

The concentration of Ti in a Ti pickle bath is determined by polarography in an oxalic acid electrolyte.

The concentration of Ni in a Zn phosphatation bath is determined by polarography in ammonia buffer pH 9.3.

The concentration of Fe(total) is determined by polarography in alkaline electrolyte containing triethanolamine (TEA) and KBrO3. All reagents typically contain Fe impurities. Therefore a subtraction of the reagent blank is recommended.

Electroless nickel plating is an important and well established process in the surface finishing industry. In the past, the addition of small amounts of lead has widely been used to stabilize the plating bath. With the increasing number of restrictions in recent years on the use of lead in consumber products, particularly electronics, alternative stabilizers were developed and introduced. One of the stabilizers used as lead replacement is iodate. It can be used as a single additive or in combination with bismuth or antimony. This method allows the determination of iodate directly in the plating bath sample by polarography. The method is simple and fast, however, sensitive and robust.

Electroless nickel plating is an important and well established process in the surface finishing industry. In the past the addition of small amounts of lead has widely been used to stabilize the plating bath. With the increasing number of restrictions in recent years on the use of lead in consumber products, particularly electronics, alternative stabilizers were developed and introduced. Two of the stabilizers used as lead replacement are antimony and bismuth. They can be used as a single additive or in combination with each other or iodate. This method allows the determination of antimony and bismuth directly in the plating bath sample by anodic stripping voltammetry (ASV). The method is simple and fast, however sensitive and robust

Monitoring Sb(III) stabilizer levels during electroless Ni plating is critical for high-quality coatings. Anodic stripping voltammetry offers fast, reliable Sb(III) analysis.

Electroless nickel plating ensures low-cost wear and corrosion resistance. Monitoring lead stabilizer levels in Ni plating baths is possible with the Bi drop electrode.

Electroless Ni plating offers superior surface finish and corrosion resistance. Anodic stripping voltammetry allows Bi stabilizer to be monitored in Ni plating baths.

Free white paper describes the effective use of electrochemical techniques to measure corrosion and the effectiveness of inhibitors.

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